Multi-Layer Boards Electronic Component Sourcing RCC Conformal Coating
Electronic Component Sourcing Description:
The PCB assembly we produce includes rapid turn prototype PCB assembly, SMT/SMD assembly, through-hole assembly, hybrid technology (SMT/through-hole), turnkey assembly, consignment assembly, etc. They are widely used in industrial control, medical care, automotive electronics, communications, and the Internet. SMT, post welding, assembly to testing one-stop service supports flexible supply.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
FAQ:
Q. What service can you supply?
TongZhan was founded in 2011 and is committed to being a leading one-stop EMS provider. We specialize in high-speed turn-key PCB services: PCB design, Fabrication, Components sourcing, PCBA, and Supply Chain service.
Q: What are the payment terms we can accept?
We recommend that you use T/T, and other needs can be communicated with our staff.
Electronic Component Sourcing Introduction:
1. Provide mechanical support for fixing and assembling various electronic components such as integrated circuits, realize wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provide required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide identification characters and graphics for component insertion, inspection, and maintenance.
3. Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.
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